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                HAD2610平面式高速固晶機
                    發布時間: 2020-09-09 18:26    

                HAD2610(平面式高速固晶機)

                (周期:130ms

                適用于普通貼片,二極管,三極管等


                一、機型特性

                1.采用國際領先的固晶,點膠,晶片搜尋系統;

                2.單邦雙臂結構,采用電機旋轉+音圈上下驅動固晶擺臂;

                3.采用絲桿伺服驅動搜尋晶片平臺(X/Y)與線性電機驅動送料平臺(B/C);

                4.采用晶框自動校正晶片結構以及自動擴藍膜結構,兼容6寸和8寸晶圓;

                5.采用新式恒溫點膠系統;

                6.采用真空漏晶檢測;

                7.兩種上料方式:疊料方式吸支架上料或料盒方式推支架進料,人性化操作,提高生產效率;

                8、收料采用:料盒方式收料,有效提高了生產效率;

                9、工控機控制設備運行,簡化了自動化設備的操作;

                10、精準的自動化設備為企業提高生產效率,降低成本提供了有效保障,從而切實有效地提高了企業競爭力;

                11、固晶位置精準及優良的一致性為后道工序提供了先天的保障。

                HAD2610Planar High-speed Die Bonder

                Cycle: 130ms

                Suitable for ordinary chip, diode, triode

                Model Features

                1. Adopt the international leading die-bonding, dispensing and wafer search system;

                2. Single-bonder and double-arm structure, motor rotation + voice coil up and down to drive the solid-crystal swinging arm;

                3. Using screw servo drive to search chip platform (X/Y) and linear motor drive feeding platform (B/C);

                4. Adopt the crystal frame to automatically correct the wafer structure and automatically expand the blue film structure, compatible with 6-inch and 8-inch wafers;

                5. Adopt the new constant temperature dispensing system;

                6. Vacuum die missing test is adopted;

                7. Two loading modes: stacking mode, suction bracket loading mode or material box mode, pushing bracket loading mode, humanized operation, improving production efficiency;

                8. Material receiving: material box, effectively improving production efficiency;

                9. IPC controls the operation of equipment, which simplifies the operation of automatic equipment;

                10. Accurate automation equipment provides an effective guarantee for enterprises to improve production efficiency and reduce costs, thus effectively improving the competitiveness of enterprises;

                11. Precise location and excellent consistency of die bonding provide innate guarantee for the later process.




                二、規格參數/Specifications and Parameters

                1.系統功能/System Function

                4、吸晶擺臂機械手系統/Die Bonder’s Swing

                Arm-and-hand System

                生產周期

                /Production Cycle

                130ms(取決于晶片尺寸及支架密集度)

                (Depending on Die Size and Holder Density)

                吸晶擺臂

                /Swing Arm of Die Bonder

                180°可旋轉固晶

                (Rotatable Die Bond)

                XY精度/Accuracy

                ±1mil(±0.025mm

                吸晶壓力

                /Die Bond Pressure

                可調20g250g

                (Adjustable)

                芯片旋轉/Die Rotation

                ±3°

                5.送料工作平臺/Loading Workbench

                2.芯片XY工作臺/Die XY Workbench

                行程范圍

                /Range of Stroke

                250mm*75mm

                芯片尺寸

                /Die Dimensions

                5mil×5mil-80mil×80mil
                (0.13mm*0.13mm-2mm*2mm)

                XY分辨率

                /XY Resolution

                0.02mil0.5μm

                6.適用支架尺寸/Suitable Holder’s Size

                晶片最大角度修正

                /Max.Angle Correction

                ±15°

                支架長度/Length

                150 ~ 250mm

                最大芯片環尺寸

                Max.Die Ring Size

                10″(254mm)外徑  鐵環

                External Diameter Iron Ring

                支架寬度/Width

                28mm~ 75mm

                最大芯片面積尺寸

                /Max.Die Area

                8″(210mm)擴張后

                7.所需設施/Facilities Needed

                分辨率

                /Resolution Ratio

                1μm

                電壓/頻率

                /Voltage/Frequency

                220V AC±5%/50HZ

                重復率

                /Repetitive Rate

                0.8μm

                壓縮空氣

                /Compressed Air

                0.5MPaMIN

                頂針Z高度行程

                /Thimble Z Height Stroke

                80mil2mm

                額定功率

                /Rated Power

                950W

                3.圖像識別系統/Image Recognition System

                耗氣量

                /Gas Consumption

                40L/min

                圖像識別

                /Image Recognition     

                256級灰度(Level Grey)

                8.體積及重量/Volume and Weight

                分辨率

                /Resolution

                656X492像素(Pixels)

                xx

                /Length*Width*Height

                135X120X175cm

                圖像識別精準度

                /Image Recognition Accuracy

                ±0.025mil@50mil觀測范圍

                (Scope of Observation)

                重量

                /Weight

                1250kg

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