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                HAD816-B全自動高速固晶機
                    發布時間: 2020-09-09 18:24    

                HAD816-B(全自動高速固晶機)

                (周期: 120ms

                適合于矩陣式粘膠工藝的IC支架,如DFN/QFN系列、SOP系列


                一、機型特性

                1.點膠模組可擴展性適應客戶支架;高達4組點膠針頭,大大提高了點膠效率,每組點膠機構X/Y/Z向可調整方便調試維護;

                2.采用線性電機驅動搜尋晶片平臺(X/Y)與送料平臺(B/C);

                3.wafer table自動校正芯片位置;

                4.自主研發工控機控制系統,簡單易操作&維護;

                5.流量式芯片真空檢測,穩定可靠;

                6.自主研發視覺系統for pre-bond/pos-bond,穩定可靠;

                7.材料/產品的全自動載入載出,高生產效率的保證;

                8.固晶位置精準及優良的一致性,高品質產品的保證;

                9.節拍:120毫秒/點,實際產出取決于芯片尺寸和支架上產品的密集度;

                10.bondforce參數化調整,穩定可靠。

                HAD816-BAutomatic High-speed Die Bonder

                Cycle: 120ms

                It is compatible with IC leadframe of matrix viscose process, such as DFN/QFN series, SOP series.


                Model Features

                1. The dispensing module is expandable to adapt to customer support; up to 4 sets of dispensing needles, greatly improving the efficiency of dispensing. The Dispensing mechanism of each set can be adjusted in X/Y/Z direction for convenient debugging and maintenance.

                2. Using linear motor to drive the search chip platform (X/Y) and the feeding platform (B/C);

                3. Wafer table automatically corrects the position of the chip;

                4. Independently developed industrial computer control system, easy to operate and maintain;

                5. Flow type chip vacuum detection, stable and reliable;

                6. Independently developed visual system for pre-bond/ pos-bond, stable and reliable;

                7. Fully automatic loading and unloading of materials/products, ensuring high production efficiency;

                8. Precise location of die bonding and excellent consistency, guarantee high quality products;

                9. Beat: 120 ms/point, actual output depends on chip size and density of products on the bracket;

                10. Bondforce parameterized adjustment, stable and reliable.



                二、規格參數/Specifications and Parameters

                1.系統功能/System Function

                4、吸晶擺臂機械手系統/Die Bonder’s Swing Arm-and-hand system

                生產周期

                /Production Cycle

                120ms(取決于晶片尺寸及支架)(Depending On Die Size And Holder)

                吸晶擺臂/Swing Arm of Die Bonder

                bondforce參數化調整

                固晶精度/Accuracy

                ±1mil(±0.025mm

                吸晶壓力

                /Die Bond Pressure

                可調20g-250g

                (Adjustable)

                芯片旋轉/Die Rotation

                ±3°

                5.送料工作平臺/Loading Workbench

                2.芯片XY工作臺/Die XY Workbench

                行程范圍

                /Range of Stroke

                300mm*100mm

                芯片尺寸

                /Die Dimensions

                5mil×5mil-90mil×90mil
                (0.13mm*0.13mm-2.3mm*2.3mm)

                XY分辨率

                /XY Resolution

                0.02mil0.5μm

                6.適用支架尺寸/Suitable Holder’s Size

                晶片最大角度修正/Max. Angle Correction

                ±180°

                支架長度/Length

                150mm~ 300mm(單粘膠可做小于150mm支架)

                最大芯片環尺寸/Max. Die Ring Size

                10″(254mm)外徑  鐵環(External Diameter) Iron Ring

                支架寬度/Width

                50mm~ 100mm

                最大芯片面積尺寸/Max. Die Area

                8(Expanded)

                7.所需設施/Facilities Needed

                分辨率

                /Resolution Ratio

                1μm

                電壓/頻率/Voltage/Frequency

                220V AC±5%/50HZ

                頂針Z高度行程

                /Thimble Z Height Stroke

                160mil4mm

                壓縮空氣

                /Compressed Air

                0.5MPaMIN

                額定功率/Rated Power

                930W

                3.圖像識別系統/Image Recognition System

                耗氣量

                /Gas Consumption

                40L/min

                灰階度/Grey Scale

                256級灰度(Level Grey)

                8.體積及重量/Volume and Weight

                分辨率/Resolution

                656X492像素(Pixels)

                xx/Length x Width x Height

                220X120X155(不含顯示器)cm

                圖像識別精準度/Image Recognition Accuracy

                ±0.025mil@50mil觀測范圍

                (Observation Range)

                重量/Weight

                1300kg

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