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                HAD816-A全自動高速固晶機
                    發布時間: 2020-09-09 18:22    

                HAD816-A(全自動高速固晶機)

                (周期: 120ms

                適合于矩陣式沾膠工藝的IC支架,如DFN/QFN系列、SOP系列


                一、機型特性

                1.采用國際領先的單邦雙臂固晶,可程式恒溫雙沾膠,晶片搜尋系統;

                2.自主研發視覺系統&工控機控制系統,簡化了自動化設備的操作,簡單易操作&維護;

                3.材料/產品的自動載入載出,疊料方式吸支架上料具備吸紙功能,料盒載出,有效提高了生產效率;

                4.采用絲桿伺服驅動搜尋晶片平臺(X/Y)與線性電機驅動送料平臺(B/C);

                5.采用晶框自動校正晶片結構以及自動擴藍膜結構,兼容8寸和6寸晶圓;

                6.單邦雙臂固晶bondforce參數化調整,流量式芯片真空檢漏晶測,穩定可靠;

                7.可程式恒溫雙沾膠模組,效率大幅提升,膠點精度和一致性高;

                8.固晶位置精準及優良的一致性,高品質產品的保證;

                9.節拍:120毫秒/點,實際產出取決于芯片尺寸和支架上產品的密集度;

                10.進收料采用外掛模式,可多臺設備聯機生產。

                HAD816-AAutomatic High-speed Die Bonder

                Cycle: 120ms

                It is compatible with IC leadframe of matrix viscose process, such as DFN/QFN series, SOP series.


                Model Features

                1. International leading single die bonder and double swing arms, with programmable constant temperature double adhesive, and chip searching system.

                2. Independently developed visual system & industrial computer control system, simplifying the operation of automatic equipment, easy to operate & maintain.

                3. Automatic loading and unloading of materials/products, the loading of stacking material suction leadframe has the function of paper suction, and magazine unloading, effectively improving the production efficiency.

                4. Screw servo drive is adopted to drive chip searching platform (X/Y) and linear motor is adopted to drive feeding platform (B/C).

                5. Automatic frame-correcting wafer structure and automatic blue-expanding membrane structure, compatible with 8-inch and 6-inch wafers.

                6. Single die bonder and double swing arms, bondforce parameter adjustment, flow-type chip vacuum leaking detection crystal measurement, stable and reliable.

                7. Programmable constant temperature double adhesive module, greatly improving efficiency, glue point accuracy and consistency.

                8. Precise location and good consistency of die bonding, guarantee of high quality.

                9. Beat: 120 ms/point. Actual output depends on chip size and the density of products on the leadframe.

                10. The material incoming and receiving adopt plug-in mode, and multiple equipments can be operated online.



                二、規格參數/Specifications and Parameters

                1.系統功能/System Function

                4、吸晶擺臂機械手系統/Die Bonder’s Swing Arm-and-hand system

                生產周期

                /Production Cycle

                120ms(取決于晶片尺寸及支架)(Depending On Die Size And Holder)

                吸晶擺臂/Swing Arm of Die Bonder

                180°可旋轉固晶(Rotatable Die Bond)

                XY位置精度/Accuracy

                ±1mil(±0.025mm

                吸晶壓力

                /Die Bond Pressure

                可調20g-250g

                (Adjustable)

                芯片旋轉/Die Rotation

                ±3°

                5.送料工作平臺/Loading Workbench

                2.芯片XY工作臺/Die XY Workbench

                行程范圍

                /Range of Stroke

                300mm*100mm

                芯片尺寸

                /Die Dimensions

                5mil×5mil-90mil×90mil
                (0.13mm*0.13mm-2.3mm*2.3mm)

                XY分辨率

                /XY Resolution

                0.02mil0.5μm

                6.適用支架尺寸/Suitable Holder’s Size

                晶片最大角度修正/Max. Angle Correction

                360°

                支架長度/Length

                150mm~ 300mm

                最大芯片環尺寸/Max. Die Ring Size

                10″(254mm)外徑  鐵環(External Diameter) Iron Ring

                支架寬度/Width

                50mm~ 100mm

                最大芯片面積尺寸/Max. Die Area

                8″(210mm)擴張后(Expanded)

                7.所需設施/Facilities Needed

                分辨率

                /Resolution Ratio

                1μm

                電壓/頻率/Voltage/Frequency

                220V AC±5%/50HZ

                頂針Z高度行程

                /Thimble Z Height Stroke

                160mil4mm

                壓縮空氣

                /Compressed Air

                0.5MPaMIN

                額定功率/Rated Power

                930W

                3.圖像識別系統/Image Recognition System

                耗氣量

                /Gas Consumption

                40L/min

                灰階度/Grey Scale

                256級灰度(Level Grey)

                8.體積及重量/Volume and Weight

                分辨率/Resolution

                656X492像素(Pixels)

                xx/Length x Width x Height

                220X120X155(不含顯示器)cm

                圖像識別精準度/Image Recognition Accuracy

                ±0.025mil@50mil觀測范圍

                (Observation Range)

                重量/Weight

                1300kg

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