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                HAD205-PDCO支架刷膠機
                    發布時間: 2019-06-30 16:55    

                HAD205-P(支架刷膠機)

                (周期:20s

                適用于SMA,SMB,SMC,SMAF矩陣式多排支架產品等。

                一、機型特性

                刷膠工藝對膠量一致性/焊層控制較點膠和沾膠有明顯的優越性

                堅固厚重的機構/網板座的可微調整設計,保證平臺和網板的相對水平

                數據處理能力:;

                1,錫膏點位置/大小實時檢測表格顯示,位置/大小超出上下限報警停機

                2,錫膏點位置/大小數據保存可追蹤查詢;

                3,錫膏點位置/大小數據統計功能, ;

                4,錫膏點位置/大小數據檢測結果生成mappingdie attaching使用。

                HAD205-P

                Screen Printing Machine

                Cycle: 20 s

                It is compatible with SMA,SMB,SMC,SMAF matrix multi-row bracket products .

                Product Features

                To the consistency of the glue amount/ the controlling of weld layer void, the cementing possess obvious advantages over dispending and sticking way 

                Sturdy and heavy mechanism/ micro-adjustable stencil seat to ensure the relative level of the platform and the stencil

                Data processing capabilities:

                1.      Real time detection table display of the solder paste mark position/ size, auto-shutdown alarming system if position/size exceeds the upper and lower limits;

                2.      Solder paste mark position/ size data preservation for querying anytime;

                3.      Solder paste mark position/ size data statistics function.;

                4.      Solder paste mark position/ size data detection results generate mapping for die attaching.

                二、規格參數

                Specifications and Parameters

                1.系統功能/System Function

                生產周期/Production Cycle

                20 s

                膠點精度/Accuracy

                ±2mil(±50um)

                膠點大小/ Area

                 ≦直徑10% (膠點> 0.80 mm);≦直徑15% (膠點< 0.8 mm)

                2.送料工作平臺/Loading Workbench

                行程范圍/Range of Stroke

                100mm*300mm

                3.適用支架尺寸/Suitable Holder’s Size

                支架長度/Length

                150mm~ 300mm

                支架寬度/Width

                50mm~ 100mm

                4.所需設施/Facilities Needed

                電壓/頻率/Voltage/Frequency

                220V AC±5%/50HZ

                壓縮空氣/Compressed Air

                0.5MPaMIN

                額定功率/Rated Power

                500W

                耗氣量/Gas Consumption

                40L/min

                5.體積及重量/Volume and Weight

                xx/Length x Width x Height

                139×85×180cm

                重量/Weight

                800kg

                6.圖像識別系統/Image Recognition System

                灰階度/Grey Scale

                256級灰度(Level Grey)

                分辨率/Resolution

                2560×1920像素(Pixels)

                圖像識別精準度/Image Recognition Accuracy

                ±0.025mil@50mil觀測范圍(Observation Range)

                HAD205-D(平面式雙頭高速固晶機)

                (周期:120ms

                適用于SMA,SMB,SMC,SMAF矩陣式多排支架產品等。

                一、機型特性

                1.采用國際領先的雙固晶,雙芯片搜尋系統;

                2.采用直驅電機驅動邦頭

                3.采用線性電機驅動搜尋芯片平臺(X/Y)與送料平臺(B/C

                4. 晶框采用自動角度修正系統;

                5.采用真空漏晶檢測;

                6. 采用自動式上下晶環、自動接駁臺結構,有效提高了生產效率;

                7. 工控機控制設備運行,簡化了自動化設備的操作;

                8.精準的設備化設備為企業提高生產效率,降低成本提供了有效保障,從而切實有效地提高了企業競爭力;

                9. 精準的固晶位置及優良的一致性為后道工序提供了先天的保障

                HAD205-D

                Plane-type High-speed Die Bonder

                Cycle: 120ms

                It is compatible with SMA,SMB,SMC,SMAF matrix multi-row bracket products .

                Product Features

                1.      International leading double die bond and double die searching system;

                2.      Linear motor is applied to drive bond head;

                3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

                4.      Automatic chip that alignment system is applied on the Crystal frame;

                5.      Vacuum die missing testing technology is adopted;

                6.      Automatic up & down crystal rings and automatic inspection conveyor system is applied to improve the production efficiency largely;

                7.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

                8.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

                9.      Precise die bond location and excellent compatibility will guarantee the back-end processing.

                二、規格參數

                Specifications and Parameters

                1.系統功能/System Function

                4、吸晶擺臂機械手系統/

                Die Bonder’s Swing Arm-and-hand system

                生產周期/Production Cycle

                120ms(取決于芯片尺寸及支架密集度)(Depending On Die Size And support load bearing capacity)

                吸晶擺臂/

                Swing Arm of Die Bonder

                雙邦雙臂 (Rotatable Die Bond with Double Swing Arms)

                XY位置精度/Accuracy (帶芯片校正功能/ With Die Correcting Feature)

                ±1.5mil(±38um)

                吸晶壓力/

                Die Bond Pressure

                可調30g—300g(Adjustable)

                芯片旋轉/Die Rotation

                ±3°

                5.送料工作平臺/Loading Workbench

                2.芯片XY工作臺/Die XY Workbench

                行程范圍/

                Range of Stroke

                100mm*300mm

                芯片尺寸/

                Die Dimensions

                5mil×5mil-80mil×80mil
                (0.13mm*0.13mm-2.0mm*2.0mm)

                XY分辨率/

                XY Resolution

                0.02mil0.5μm

                6.適用支架尺寸/Suitable Holder’s Size

                芯片最大角度修正/Max. Angle Correction

                ±180°

                支架長度/Length

                150mm ~ 300mm

                最大芯片環尺寸/

                Max. Die Ring Size

                6″與7″可選(Optional)

                支架寬度/Width

                50mm~ 100mm

                最大芯片面積尺寸/Max. Die Area

                4″(101mm)、5127mm

                7.所需設施/Facilities Needed

                分辨率/

                Resolution Ratio

                0.04mil  (1μm)

                電壓/頻率/Voltage/Frequency

                220V AC±5%/50HZ

                頂針Z高度行程/Thimble Z Height Stroke

                80mil2mm

                壓縮空氣/

                Compressed Air

                0.5MPaMIN

                額定功率/Rated Power

                1000W

                3.圖像識別系統/Image Recognition System

                耗氣量/

                Gas Consumption

                40L/min

                灰階度/Grey Scale

                256級灰度(Level Grey)

                8.體積及重量/Volume and Weight

                分辨率/Resolution

                656×492像素(Pixels)

                xx/

                Length x Width x Height

                192×85×180cm

                圖像識別精準度/Image Recognition Accuracy

                ±0.025mil@50mil觀測范圍(Observation Range)

                重量/Weight

                1250kg

                HAD205-C(全自動裁切機)

                (周期:90ms&取決客戶支架與跳線料帶的分布及生產線綜合效率)

                適用于SMA,SMB,SMC,SMAF矩陣式多排跳線料帶產品等

                一、機型特性

                1Die dispensing

                穩固的機構設計;點膠模組可擴展性適應客戶支架;高達4組點膠針頭,大大提高了點膠效率,每組點膠機構X/Y/Z向可調整方便調試維護;

                2Clip attaching

                高精密度沖切模具可保證切口毛刺小于0.05mm;刀具壽命可達1kk次;clip bond force參數化設定可保證芯片不受損

                數據處理能力:

                a,點膠點和Clip安裝點位置/大小實時檢測表格顯示,位置/大小超出上下限報警停機

                b,點膠點和Clip安裝點位置/大小數據保存可追蹤查詢

                c,點膠點和Clip安裝點位置/大小數據統計功能

                d,點膠點和Clip安裝點位置/大小數據檢測結果生成mappingdie attaching使用

                HAD205-C

                Clip and Cutting Machine

                Cycle: 90ms

                It is compatible with SMA,SMB,SMC,SMAF matrix multi-row bracket products .

                Product Features

                1.      Die Dispensing

                Stable mechanism design; Dispensing module can adapt to your holder; there are up to 4 sets of dispensing needles, which improved the dispensing efficiency greatly, each group of dispensing mechanism X / Y / Z direction are adjustable which facilitates debugging and maintenance;

                2, Clip Attaching

                The cutting burr is less than 0.05mm with the high-precision die-cutting mold; the tool life can reach to 1kk times; the clip bond force parameterization can protect the chip from damage.

                Data processing capabilities:

                a, Real time detection table display of the dispensing mark and clip mounting mark position/ size, auto-shutdown alarming system if position/size exceeds the upper or lower limits;

                b, Dispensing mark and clip mounting mark position/ size data preservation for querying anytime;

                c, Dispensing mark and clip mounting mark position/ size data statistics function;

                d, Dispensing mark and clip mounting mark position/ size data detection results generate mapping for die attaching.

                二、規格參數

                Specifications and Parameters

                1.系統功能/System Function

                生產周期/Production Cycle

                90ms(取決客戶支架與跳線料帶的分布及生產線綜合效率)

                膠點精度/Accuracy

                ±2mil(±50um)角度±3°(爐前)

                膠點大小/ Area

                 ≦直徑10% (膠點> 0.80 mm);≦直徑15% (膠點< 0.8 mm)

                2.送料工作平臺/Loading Workbench

                行程范圍/Range of Stroke

                100mm*300mm

                3.適用支架尺寸/Suitable Holder’s Size

                支架長度/Length

                150mm ~ 300mm

                支架寬度/Width

                50mm~ 100mm

                4.所需設施/Facilities Needed

                電壓/頻率/Voltage/Frequency

                220V AC±5%/50HZ

                壓縮空氣/Compressed Air

                0.5MPaMIN

                額定功率/Rated Power

                1000W

                耗氣量/Gas Consumption

                40L/min

                5.體積及重量/Volume and Weight

                xx/Length x Width x Height

                150×95×180cm

                重量/Weight

                1000kg

                6.圖像識別系統/Image Recognition System

                灰階度/Grey Scale

                256級灰度(Level Grey)

                分辨率/Resolution

                656×492 & 2560×1920像素(Pixels)

                圖像識別精準度/Image Recognition Accuracy

                ±0.025mil@50mil觀測范圍(Observation Range)

                HAD205-O(全自動接觸式烤爐)

                (周期:15-30s

                適用于SMA,SMB,SMC,SMAF矩陣式多排支架產品等。

                一、機型特性

                1.產能 = 10~30 Sec. / 每一片(按錫膏商建議的Profile)

                2.低耗電(升溫時26KW/保溫時2KW);低耗氣(100/)

                3.無氧化焊接 ,含氧量100ppm以下

                4.同一溫區 溫差小于10?C ,可程序化之溫度曲線設定

                5.實時溫度監控

                6.不卡料之料片傳送機構

                二、優越性:

                1.油煙處理 : 靜電式油煙收集方式,回流焊接時產生之廢氣經處理后可直排室內

                2.爐內腔體清潔保養周期 : 依錫膏品質/成份不同而異,如indium免清洗錫膏可一周清潔一次爐內腔體

                3.自動profile功能:系統可自動產生爐溫曲線,并可保存查詢

                4.爐蓋加熱:爐蓋備有加熱功能,保證焊油不在爐蓋上凝聚

                5.加熱棒:選用高品質加熱棒,保證同一溫區各點實測最高溫減最低溫小于或等于10

                HAD205-O

                Reflow Oven

                Cycle: 15-30s

                It is compatible with SMA,SMB,SMC,SMAF matrix multi-row bracket products .

                Product Features

                1. Capacity is 10~30 Sec. per piece (as recommended Profile by solder paste)

                2. Low power consumption (26KW when warming up/2KW when keep warming); low gas consumption (100 liters/min)

                3. No oxidation welding (nitrogen or nitrogen-hydrogen mixture), oxygen content below 100ppm

                4. The temperature difference is less than10 ?C in the same temperature zone, Programmable temperature curve setting

                5. Instant temperature monitoring

                6. Unloaded web transfer mechanism

                Superiority

                1. Lampblack treatment: Electrostatic lampblack collection, the exhaust gas generated during reflow soldering can be directly discharged indoors after being treated;

                2. The cycle of furnace cavity cleaning and maintenance: Depending on the quality/component of the solder paste, such as indium no-clean solder paste which needs to clean the inner cavity once a week;

                3. Automatic profile function: the system can generate the furnace temperature curve automatically and preserve the data for querying anytime;

                4. Furnace cover heating: The furnace cover is equipped with heating function to preserve the welding oil from condense on the furnace cover.

                5. Heating rod: the high-quality heating rod is adopted which can ensure that the actual measurement of the highest temperature minus the lowest temperature in each temperature zone is less than or equal to 10.

                三、規格參數:

                Specifications and Parameters

                1.系統功能/System Function

                生產周期/Production Cycle

                15-30s

                氣泡率/Bubble rate

                氣泡率≦10%(錫膏/支架表面/芯片背層良好情況下),

                單顆氣泡率<3%,總的氣泡率<10%

                爐后芯片位置/Accuracy

                ±0.075mm,角度±5°

                2.送料工作平臺/Loading Workbench

                行程范圍/Range of Stroke

                100mm*300mm

                3.適用支架尺寸/Suitable Holder’s Size

                支架長度/Length

                150mm ~ 300mm

                支架寬度/Width

                50mm~ 100mm

                4.所需設施/Facilities Needed

                電壓/頻率/Voltage/Frequency

                380V AC±5%/50HZ

                壓縮空氣/Compressed Air

                0.5MPaMIN

                額定功率/Rated Power

                6500W

                耗氣量/Gas Consumption

                40L/min

                5.體積及重量/Volume and Weight

                xx/Length x Width x Height

                210×120×175cm

                重量/Weight

                1200kg

                6.溫度/Temperature

                范圍/Range

                0400

                7.水流量及水溫/Water Flow and Temperature

                水流量/Water Flow

                5L / Min

                水溫/Water Temperature

                15~20?C

                8.適用氣體 Suitable Gas

                N2 only    100 L/min

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